Deng, Yangdong (Autor) Maly, Wojciech P. (Autor)

3-Dimensional VLSI

A 2.5-Dimensional Integration Scheme

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Beschreibung

"3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme"elaborates the concept and importance of 3-Dimensional (3-D) VLSI. The authors have developed a new 3-D IC integration paradigm, so-called 2.5-D integration, to address many problems that are hard to resolve using traditional non-monolithic integration schemes. The book also introduces major 3-D VLSI design issues that need to be solved by IC designers and Electronic Design Automation (EDA) developers. By treating 3-D integration in an integrated framework, the book provides important insights for semiconductor process engineers, IC designers, and those working in EDA R&D.

Produktdetails

ISBN/GTIN 978-3-642-04157-0
Seitenzahl 200 S.
Kopierschutz Digital Rights Management
Dateigröße 7202 Kbytes

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