Suhir, Ephraim (Hrsg.)
Lee, Y. C. (Hrsg.)
Wong, C. P. (Hrsg.)
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging. Vol.1
Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging

Beschreibung
The handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials, assemblies, structures and systems. Each chapter contains a summary of the state-of-the-art in a particular field and practical recommendations on how to apply current knowledge and technology to design, manufacture and operate a viable, reliable and cost-effective electronic component or photonic device, and on how to make such a device into a successful commercial product.The handbook can be used as a reference and as a manual for self-education. Designed and written for electrical, materials, mechanical, and reliability engineers, as well as applied physicists and materials scientists - this will be an essential reference for all those who are interested in the state-of-the-art of micro- and opto-electronic materials, packaging , and reliability, with an emphasis on physical design problems, challenges, and solutions.
Produktdetails
ISBN/GTIN | 978-0-387-32989-5 |
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Seitenzahl | 1460 S. |
Kopierschutz | mit Wasserzeichen |
Dateigröße | 36175 Kbytes |